Equipment Introduction
Single-axis single-station structural design
It can be applied to most wafer processing requirements, taking into account both full surface grinding and edge grinding
Main parameters
|
Specifications |
Unit |
Technical indicators |
|
Workpiece diameter |
mm |
Ø150 / Ø300 |
|
Grinding method |
|
Full surface grinding / edge grinding |
|
Diamond grinding wheel (compatible with DISCO grinding wheel) |
mm |
Ø300 |
|
Quantity of grinding wheel spindles |
|
1 |
|
Grinding spindle power |
kW |
7.5 |
|
Grinding wheel shaft speed |
r/min |
1000~4000 |
|
Z-axis travel |
mm |
120 |
|
Z-axis grinding feed speed |
mm/s |
0.0001~0.08 |
|
Z-axis minimum feed |
µm |
0.1 |
|
Silicon wafer thickness measurement range |
µm |
0~1800 |
|
Thickness measurement resolution |
µm |
0.1 |
|
Clamping method |
|
Porous vacuum suction cup |
|
Number of workpiece axes |
|
1 |
|
Workpiece axis speed |
r/min |
10~300 |
|
TTV after grinding |
µm |
1.5 |
|
Thickness deviation between pieces after grinding |
µm |
±3 |
|
Surface roughness after fine grinding |
Ra |
10nm |
|
Outline dimensions (W × D × H) |
mm |
850×1760×1900 |
|
Net weight of the whole machine |
kg |
2200 |
