Equipment Introduction
• For grinding and thinning of 300mm silicon wafers
• It adopts a structure of single spindle, double worktable and one rotary table, achieving simple and compact fully automatic grinding
Main features
• It fully automatically completes the processes of taking tablets, centering, soaking, grinding, unloading tablets, cleaning and drying, and loading tablets
• It features functions such as automatic thickness measurement compensation and automatic grinding wheel tool setting
• Both the grinding wheel spindle and the workpiece spindle adopt high-precision and high-rigidity air hydrostatic bearings
• The human-machine user control screen can synchronously display the processing status and equipment status
Instance effect
A 300mm wafer after grinding
Main parameters
